BASF announces cooperation with HP Indigo
| Subj: Press-releses
BASF has recently entered a strategic collaboration with HP Indigo, the world’s leading manufacturer of digital printing presses. Both companies will collaborate to develop water-based adhesive solutions for flexible packaging that are specially tailored for the requirements of the HP Indigo ElectroInk process, a highly flexible and fast digital printing process.
BASF’s water-based adhesive systems are an environmentally compatible and economically rewarding alternative to conventional technologies when it comes to the lamination of flexible food packaging. The Epotal® lamination systems offer significant advantages over solvent and solvent-less adhesives. Beside a lower carbon footprint, these systems provide increased flexibility and accelerated production procedures due to their unique polymer design.
“HP is constantly looking into faster turnaround time to extend the value of the digital printing applications,” said Nurit Raccah, Labels and Packaging Media and Materials Business Manager, Indigo division, HP. “This strategic collaboration with BASF, a leading player in the adhesive industry, demonstrates our continued commitment to providing HP Indigo customers full end-to-end solutions with extended performance.”
BASF adhesive solutions for Indigo digital printing
The expansion of HP Indigo digital printing into mainstream flexible packaging required a validation of various adhesive performances with the HP Indigo ElectroInk. Thus, BASF accomplished several lamination solutions for digital printing including adhesives for dry lamination for food packaging.
“Recently we have developed innovative high-performance water-based adhesives for digital inks: Epotal® DP3820X and Basonat® LR 9056,” said Dr Axel Weiss, Head of Marketing Dispersions for Industrial Adhesives Europe at BASF. “In combination with HP Indigo Pack Ready Coating these adhesives enable the production of retort pouches with best lamination quality.”
A sample of this innovation technology will be displayed at the booths of BASF (Hall 10, B 43) and HP (Hall 13, C 77) at Interpack 2017 in Düsseldorf from May 4-10.