CHINAPLAS 2017 facilitates automotive industry towards lightweighting and smart manufacturing
| Subj: Press-releses
As energy and environmental protection become increasingly important global issues, a lot of efforts have been put into lightweighting vehicles, as the reduced weight of a vehicle attributes a lot to the efficient use of energy. According to statistics, a 100kg reduction in car weight can translate into a 10% increase in driving mileage and a 15% to 20% decrease in power costs. It also helps reduce carbon emission. These factors drive the automotive industry on a quest for innovative materials and material systems that help make vehicles lighter.
New materials lead to lighter and stronger automobiles
More than 1,500 exhibitors will gather at CHINAPLAS 2017 to present new materials, state-of-the-art equipment and advanced solutions to inspire the automotive industry and facilitate enterprises to explore possibilities on the journey towards lightweight and sustainability. Some of the exhibits are highlighted below.
Kraiburg Tpe (Shanghai) Co. Ltd. will introduce its UV/HF/SF series in CHINAPLAS 2017. The UV/HF/SF Series is targeted towards automotive exterior components requiring high UV resistance, perfect surface finish and high flowability. It is of easy flowing, exhibits excellent processing behavior, adheres perfectly to PP with perfect surface finish and is tested according to Volkswagen PV3930 for outdoor use. Typical applications include cowls, gaskets, roof rims, water deflectors, window encapsulations and other exterior automotive applications.
CGN Juner New Materials Co., Ltd. will introduce to visitors 65% continuous glass fiber reinforced polyamide 6 UD-tape which features high glass fiber content, high strength and modularity. The product can be applied in automotive components, such as foot pedals, seat frames, front-end frame, etc.
Polymer Science (Shenzhen) New Materials Co., Ltd. produces polyimide fiber with a wet spinning two-step production process. Compared on same molecular structure basis to the traditional one-step production process, it can increase heat resistance by nearly 100 degrees and double the strength. The company has overcome the difficulty of combining heat resistance and processability in the traditional process.
Smart Manufacturing Technology Zone to promote automotive industry
In CHINAPLAS 2017, a “Smart Manufacturing Technology Zone” will also be set up on the show floor, presenting a wealth of cutting-edge exhibits from leading suppliers, including Siemens, Bosch Rexroth, Deltacimic Electronics, Enmair, Zhejiang Keqiang, Danfoss, Sodron, LNC, Dongguan STS, Star Seiki and more. Apart from robotic arms, automated systems, controllers, actuators and sensors that were featured in the previous editions of CHINAPLAS, visitors will have a chance to witness smart factory solutions. More cutting-edge technology can be found in the “3D Technology Zone”, where 3D printers, 3D scanners, 3D printing software and 3D printing services will be displayed.
What worth mentioning is that Autodesk Software (China) Co., Ltd. will launch its Moldflow simulation software, the most popular injection molding software used by plastics molding industry so far, of which accuracy and solution efficiency is higher. Mesh model building time can be reduced by 20% with improved quality. With pre-production injection molding simulation, potential molding risk can be identified and evaluated, thus optimizing results.
Concurrent events to inspire automotive smart manufacturing
Building on the success of the first “Industry 4.0 Conference” held last year in Shanghai, CHINAPLAS will once again join force with VDMA, the German Engineering Federation, to present the “2nd Industry 4.0 Conference”. The first day of the conference (May 16, 2017) is themed “Automotive 4.0”. Representatives from KraussMaffei and Engel will give presentations on smart manufacturing technology and 4.0 solutions for the automotive industry. Shanghai Volkswagen Co. Ltd. will bring smart manufacturing case sharing to audiences. In addition, the key to the realization of “Industry 4.0” and “Made in China 2025”, standardization, will also be discussed.
CHINAPLAS is once again co-present “Design x Innovation” with BASF, the world’s leading chemical company. The theme “Smarter Living” will be demonstrated through “Inno Gallery”, ‘Design Forum” and “TRIO”, with “TRIO” represents the cooperation between BASF, designers and brand owners. Concept car RN30, an innovation that combines key solutions from the chemical industry with purposeful aerodynamic design and specialized high-performance technologies and jointly developed by BASF and Hyundai Motor Company, will be showcased in“Design x Innovation”. Answers to the question how plastics can optimize aesthetics, functionality and performance, as well as creative solutions for smarter living, can be found at “Design x Innovation”. Participants will understand product design, structural and functional design from new perspectives through the solutions presented for different downstream industries including automotive, E&E, building and construction, leisure and lifestyle, etc.
Well known suppliers will gather in CHINAPLAS 2017
CHINAPLAS 2017 will be held in China Import & Export Fair Complex, Pazhou, Guangzhou, PR China on May 16 – 19, 2017. It will feature “intelligent manufacturing, high-tech materials and green solutions” with advanced plastics machinery, materials and technologies in an exhibition area of over 250,000 square meters, showcasing the best from more than 3,300 well-known suppliers, including BASF, Clariant, Lanxess, Mitsui Chemicals, LG Chem, Polyplastics, Teijin, Jushi, Sumitomo Chemical, Arburg, Engel, HASCO, Synventive, Yizumi, Yudo, Runipsys, Autodesk and so on. CHINAPLAS is expected to attract more than 140,000 professional visitors from over 150 countries or regions. So far, a number of global leading OEMs and spare parts enterprises have already pre-registered for onsite visiting, including representatives from BYD, Nissan, General Motor, Honda, GAC Group, SAIC, Dongfeng Motor and Yanfeng etc.